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? semiconductor components industries, llc, 2009 october, 2009 ? rev. 10 1 publication order number: mc10ep11/d mc10ep11, mc100ep11 3.3v / 5v?ecl 1:2 differential fanout buffer description the mc10/100ep11 is a differential 1:2 fanout buffer . the device is pin and functionally equivalent to the lvel11 device. with ac performance much faster than the lvel11 device, the ep11 is ideal for applications requiring the fastest ac performance available. the 100 series contains temperature compensation. features ? 220 ps typical propagation delay ? maximum clock frequency > 3 ghz typical ? pecl mode operating range: v cc = 3.0 v to 5.5 v with v ee = 0 v ? necl mode operating range: v cc = 0 v with v ee = ? 3.0 v to ? 5.5 v ? open input default state ? safety clamp on inputs ? q outputs will default low with inputs open or at v ee ? pb ? free packages are available a = assembly location l = wafer lot y = year w = work week = pb ? free package h = mc10 k = mc100 5k = mc10 2z = mc100 m = date code soic ? 8 d suffix case 751 marking diagrams* tssop ? 8 dt suffix case 948r alyw hp11 alyw kp11 1 8 1 8 1 8 http://onsemi.com *for additional marking information, refer to application note and8002/d. see detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. ordering information hep11 alyw 1 8 kep11 alyw 1 8 dfn8 mn suffix case 506aa 2z m 14 (note: microdot may be in either location) 1 8
mc10ep11, mc100ep11 http://onsemi.com 2 1 2 3 4 5 6 7 8 d v ee v cc figure 1. 8 ? lead pinout (top view) and logic diagram q0 d q1 q1 q0 table 1. pin description pin d*, d ** q0, q0 , q1, q1 ecl data outputs function ecl data inputs v cc v ee negative supply positive supply * pins will default low when left open. ** pins will default to high when left open. r 1 r 2 r 1 ep (dfn8 only) thermal exposed pad must be connected to a sufficient thermal conduit. electrically connect to the most negative supply (gnd) or leave unconnected, floating open. table 2. attributes characteristics value internal input pulldown resistor 75 k internal input pullup resistor 37.5 k esd protection human body model machine model charged device model > 4 kv > 200 v > 2 kv moisture sensitivity, indefinite time out of drypack (note 1) pb pkg pb ? free pkg soic ? 8 tssop ? 8 dfn8 level 1 level 1 level 1 level 1 level 3 level 1 flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in transistor count 73 devices meets or exceeds jedec spec eia/jesd78 ic latchup test 1. for additional information, see application note and8003/d.
mc10ep11, mc100ep11 http://onsemi.com 3 table 3. maximum ratings symbol parameter condition 1 condition 2 rating unit v cc pecl mode power supply v ee = 0 v 6 v v ee necl mode power supply v cc = 0 v ? 6 v v i pecl mode input voltage necl mode input voltage v ee = 0 v v cc = 0 v v i v cc v i v ee 6 ? 6 v v i out output current continuous surge 50 100 ma ma t a operating temperature range ? 40 to +85 c t stg storage temperature range ? 65 to +150 c ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm soic ? 8 soic ? 8 190 130 c/w c/w jc thermal resistance (junction ? to ? case) standard board soic ? 8 41 to 44 c/w ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm tssop ? 8 tssop ? 8 185 140 c/w c/w jc thermal resistance (junction ? to ? case) standard board tssop ? 8 41 to 44 c/w ja thermal resistance (junction ? to ? ambient) 0 lfpm 500 lfpm dfn8 dfn8 129 84 c/w c/w t sol wave solder pb pb ? free <2 to 3 sec @ 248 c <2 to 3 sec @ 260 c 265 265 c jc thermal resistance (junction ? to ? case) (note 2) dfn8 35 to 40 c/w stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 2. jedec standard multilayer board ? 2s2p (2 signal, 2 power) table 4. 10ep dc characteristics, pecl v cc = 3.3 v, v ee = 0 v (note 3) symbol characteristic ? 40 c 25 c 85 c min typ max min typ max min typ max unit i ee negative power supply current 20 29 37 20 30 39 22 31 40 ma v oh output high voltage (note 4) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mv v ol output low voltage (note 4) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mv v ih input high voltage (single ? ended) 2090 2415 2155 2480 2215 2540 mv v il input low voltage (single ? ended) 1365 1690 1430 1755 1490 1815 mv v ihcmr input high voltage common mode range (differential configuration) (note 5) 2.0 3.3 2.0 3.3 2.0 3.3 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. input and output parameters vary 1:1 with v cc . v ee can vary +0.3 v to ? 2.2 v. 4. all loading with 50 to v cc ? 2.0 v. 5. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal.
mc10ep11, mc100ep11 http://onsemi.com 4 table 5. 10ep dc characteristics, pecl v cc = 5.0 v, v ee = 0 v (note 6) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max i ee negative power supply current 20 29 37 20 30 39 22 31 40 ma v oh output high voltage (note 7) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mv v ol output low voltage (note 7) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mv v ih input high voltage (single ? ended) 3790 4115 3855 4180 3915 4240 mv v il input low voltage (single ? ended) 3065 3390 3130 3455 3190 3515 mv v ihcmr input high voltage common mode range (differential configuration) (note 8) 2.0 5.0 2.0 5.0 2.0 5.0 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. input and output parameters vary 1:1 with v cc . 7. all loading with 50 to v cc ? 2.0 v. 8. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal. table 6. 10ep dc characteristics, necl v cc = 0 v; v ee = ? 5.5 v to ? 3.0 v (note 9) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max i ee negative power supply current 20 29 37 20 30 39 22 31 40 ma v oh output high voltage (note 10) ? 1135 ? 1010 ? 885 ? 1070 ? 945 ? 820 ? 1010 ? 885 ? 760 mv v ol output low voltage (note 10) ? 1935 ? 1810 ? 1685 ? 1870 ? 1745 ? 1620 ? 1810 ? 1685 ? 1560 mv v ih input high voltage (single ? ended) ? 1210 ? 885 ? 1145 ? 820 ? 1085 ? 760 mv v il input low voltage (single ? ended) ? 1935 ? 1610 ? 1870 ? 1545 ? 1810 ? 1485 mv v ihcmr input high voltage common mode range (differential configuration) (note 11) v ee + 2.0 0.0 v ee + 2.0 0.0 v ee + 2.0 0.0 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. input and output parameters vary 1:1 with v cc . 10. all loading with 50 to v cc ? 2.0 v. 11. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal.
mc10ep11, mc100ep11 http://onsemi.com 5 table 7. 100ep dc characteristics, pecl v cc = 3.3 v, v ee = 0 v (note 12) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max i ee negative power supply current 26 35 44 26 35 44 26 35 46 ma v oh output high voltage (note 13) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mv v ol output low voltage (note 13) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mv v ih input high voltage (single ? ended) 2075 2420 2075 2420 2075 2420 mv v il input low voltage (single ? ended) 1355 1675 1355 1675 1355 1675 mv v ihcmr input high voltage common mode range (dif- ferential configuration) (note 14) 2.0 3.3 2.0 3.3 2.0 3.3 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 12. input and output parameters vary 1:1 with v cc . v ee can vary +0.3 v to ? 2.2 v. 13. all loading with 50 to v cc ? 2.0 v. 14. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal. table 8. 100ep dc characteristics, pecl v cc = 5.0 v, v ee = 0 v (note 15) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max i ee negative power supply current 26 35 44 26 35 44 26 35 46 ma v oh output high voltage (note 16) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mv v ol output low voltage (note 16) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mv v ih input high voltage (single ? ended) 3775 4120 3775 4120 3775 4120 mv v il input low voltage (single ? ended) 3055 3375 3055 3375 3055 3375 mv v ihcmr input high voltage common mode range (differential configuration) (note 17) 2.0 5.0 2.0 5.0 2.0 5.0 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 15. input and output parameters vary 1:1 with v cc . v ee can vary +2.0 v to ? 0.5 v. 16. all loading with 50 to v cc ? 2.0 v. 17. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal.
mc10ep11, mc100ep11 http://onsemi.com 6 table 9. 100ep dc characteristics, necl v cc = 0 v; v ee = ? 5.5 v to ? 3.0 v (note 18) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max i ee negative power supply current 26 35 44 26 35 44 26 35 46 ma v oh output high voltage (note 19) ? 1145 ? 1020 ? 895 ? 1145 ? 1020 ? 895 ? 1145 ? 1020 ? 895 mv v ol output low voltage (note 19) ? 1945 ? 1820 ? 1695 ? 1945 ? 1820 ? 1695 ? 1945 ? 1820 ? 1695 mv v ih input high voltage (single ? ended) ? 1225 ? 880 ? 1225 ? 880 ? 1225 ? 880 mv v il input low voltage (single ? ended) ? 1945 ? 1625 ? 1945 ? 1625 ? 1945 ? 1625 mv v ihcmr input high voltage common mode range (differential configuration) (note 20) v ee + 2.0 0.0 v ee + 2.0 0.0 v ee + 2.0 0.0 v i ih input high current 150 150 150 a i il input low current d d 0.5 ? 150 0.5 ? 150 0.5 ? 150 a note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 18. input and output parameters vary 1:1 with v cc . 19. all loading with 50 to v cc ? 2.0 v. 20. v ihcmr min varies 1:1 with v ee , v ihcmr max varies 1:1 with v cc . the v ihcmr range is referenced to the most positive side of the dif ferential input signal. table 10. ac characteristics v cc = 0 v; v ee = ? 3.0 v to ? 5.5 v or v cc = 3.0 v to 5.5 v; v ee = 0 v (note 21) symbol characteristic ? 40 c 25 c 85 c unit min typ max min typ max min typ max f max maximum frequency (figure 2) > 3 > 3 > 3 ghz t plh , t phl propagation delay to output differential clk to q, q 140 200 250 160 220 270 180 240 300 ps t skew within device skew q0, q1 (note 22) device ? to ? device skew 10 15 110 15 20 110 20 25 120 ps t jitter random clock jitter (rms) (figure 2) 0.2 < 1 0.2 < 1 0.2 < 1 ps v inpp input voltage swing sensitivity (differential configuration) 150 800 1200 150 800 1200 150 800 1200 mv t r t f output rise/fall times q, q (20% ? 80%) @ 1.0 ghz 70 120 170 80 130 180 90 150 200 ps note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 21. measured using a 750 mv source, 50% duty cycle clock source. all loading with 50 to v cc ? 2.0 v. 22. skew is measured between outputs under identical transitions. duty cycle skew is defined only for differential operation whe n the delays are measured from the cross point of the inputs to the cross point of the outputs.
mc10ep11, mc100ep11 http://onsemi.com 7 0 100 200 300 400 500 600 700 800 900 0 1000 2000 3000 1 2 3 4 5 6 7 8 9 figure 2. output voltage amplitude (v outpp ) rms jitter vs. input clock frequency at ambient temperature input frequency (mhz) figure 3. ac reference measurement d d q q t plh v inpp = v ih (clk) ? v il (clk) v outpp = v oh (q) ? v ol (q)
mc10ep11, mc100ep11 http://onsemi.com 8 figure 4. typical termination for output driver and device evaluation (see application note and8020/d ? termination of ecl logic devices.) driver device receiver device qd q d z o = 50 z o = 50 50 50 v tt v tt = v cc ? 2.0 v resource reference of application notes an1405/d ? ecl clock distribution techniques an1406/d ? designing with pecl (ecl at +5.0 v) an1503/d ? eclinps i/o spice modeling kit an1504/d ? metastability and the eclinps family an1568/d ? interfacing between lvds and ecl an1672/d ? the ecl translator guide and8001/d ? odd number counters design and8002/d ? marking and date codes and8020/d ? termination of ecl logic devices and8066/d ? interfacing with eclinps and8090/d ? ac characteristics of ecl devices
mc10ep11, mc100ep11 http://onsemi.com 9 ordering information device package shipping ? mc10ep11d soic ? 8 98 units / rail mc10ep11dg soic ? 8 (pb ? free) 98 units / rail mc10ep11dr2 soic ? 8 2500 / tape & reel mc10ep11dr2g soic ? 8 (pb ? free) 2500 / tape & reel mc10ep11dt tssop ? 8 100 units / rail mc10ep11dtg tssop ? 8 (pb ? free) 100 units / rail mc10ep11dtr2 tssop ? 8 2500 / tape & reel mc10ep11dtr2g tssop ? 8 (pb ? free) 2500 / tape & reel MC10EP11MNR4 dfn8 1000 / tape & reel MC10EP11MNR4g dfn8 (pb ? free) 1000 / tape & reel mc100ep11d soic ? 8 98 units / rail mc100ep11dg soic ? 8 (pb ? free) 98 units / rail mc100ep11dr2 soic ? 8 2500 / tape & reel mc100ep11dr2g soic ? 8 (pb ? free) 2500 / tape & reel mc100ep11dt tssop ? 8 100 units / rail mc100ep11dtg tssop ? 8 (pb ? free) 100 units / rail mc100ep11dgh soic ? 8 (halide ? free, pb ? free) 98 units / rail mc100ep11dr2gh soic ? 8 (halide ? free, pb ? free) 2500 / tape & reel mc100ep11dtr2 tssop ? 8 2500 / tape & reel mc100ep11dtr2g tssop ? 8 (pb ? free) 2500 / tape & reel mc100ep11mnr4g dfn8 (pb ? free) 1000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc10ep11, mc100ep11 http://onsemi.com 10 package dimensions soic ? 8 nb case 751 ? 07 issue aj seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mc10ep11, mc100ep11 http://onsemi.com 11 package dimensions dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 0.80 1.10 0.031 0.043 d 0.05 0.15 0.002 0.006 f 0.40 0.70 0.016 0.028 g 0.65 bsc 0.026 bsc l 4.90 bsc 0.193 bsc m 0 6 0 6 seating plane pin 1 1 4 85 detail e b c d a g detail e f m l 2x l/2 ? u ? s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ? t ? ? v ? ? w ? 0.25 (0.010) 8x ref k ident k 0.25 0.40 0.010 0.016 tssop ? 8 dt suffix plastic tssop package case 948r ? 02 issue a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. terminal numbers are shown for reference only. 6. dimension a and b are to be determined at datum plane -w-.
mc10ep11, mc100ep11 http://onsemi.com 12 package dimensions dfn8 case 506aa ? 01 issue d notes: 1. dimensioning and tolerancing per asme y14.5m, 1994 . 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. ??? ??? ??? ??? a d e b c 0.10 pin one 2 x reference 2 x top view side view bottom view a l (a3) d2 e2 c c 0.10 c 0.10 c 0.08 8 x a1 seating plane e/2 e 8 x k note 3 b 8 x 0.10 c 0.05 c a b b dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.20 0.30 d 2.00 bsc d2 1.10 1.30 e 2.00 bsc e2 0.70 0.90 e 0.50 bsc k 0.20 ??? l 0.25 0.35 1 4 8 5 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. sc illc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scill c and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding th e design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resa le in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc10ep11/d eclinps is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative

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